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• Time Consuming Procedure can convert into non-curing process could reduce production time and costs. The metallic lead content has to be reduced to below 2 wt.% or less after the curing process 
• A higher content of free lead may result in swelling, warping and/or extensive sludge formation during the formation of positive plates
• Main Benefit of SSCFP – Curing Free Paste Additive paste must be subjected to curing and drying processes during which temperature and humidity have to be carefully controlled.
• These processes are time consuming require considerable space and energy,and hence increase product cost.
• Furthermore, the resulting plates are rather rigid and stiff, which makes them suitable
• By use of SSCFP, a paste has excellent adhesion to the grids of a battery plate
• Directions for Use: For Curing Free Paste preparation Take 100 kg.of Blend Say 60:20 Ratio of Grey Oxide & Red Lead. Take 16 Lit SSCFP – Curing Free Paste Additive Solution and add slowly slowly into paste mixer up to 20 to 25 minutes.
• Paste temperature will go high upto 80 deg celsius.
• Then start Fan cooling to paste and add water to decrease temperature,( 4 BS Structure will generate in this step)After that Only Air Dry plates – Direct Group Assembly – Charging – Discharging – Ready
• Storage: Carboys of SSCFP must be stored in cool, shaded god owns free from dusty atmosphere and away from light and heat
• Persons handling this material must take the usual precautions of wearing goggles, rubber gloves and shoes
• Packing: 35 kg Carbo drum